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says
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I feel like it'd be "easy" compared to simulating some other things, but making testing rigs is difficult, and it won't be free. There's almost no framework for it, so you'd need to do a lot of the work yourself. Probably also we will find out what we already know.How long will it take to "tune" such simulation to be accurate enough? We have anisotropic properties (different in X Y Z). As not a mechanical engineer, I will mention only hardness, elasticity and damping. And these properties are probably non-linear in the range of deformation. But let's add carbon type, glue type and heat treatment. Also, wood has huge tolerance in properties, we need to cover that. Someone will say that "simulation of the blade without rubbers will not be accurate." So let's add rubbers... This simulation sounds like a very expensive task. Who will do it?
I think correlation would be fairly easy once a rig is made, though. It's mostly a mechanical problem and you can represent a lot of it empirically and just skip the material stuff apart from maybe a spreadsheet to tune some empirical coefficients based on identified material properties. I've done as much in much more difficult mechanisms and the worst error I've ran into is about 30%. This is with viscoelastic springs that have thermal sensitivity. Maybe I'm naive, but I feel like wood alone would be simpler.
The rubber topsheet behavior would probably take multiple times the amount of time and money it'd take to solve the behavior of the blade and sponge. The mechanical properties will be relatively easy, but in reality I suspect there is a lot of flash heating and the temperature of the topsheet contact patch layer and probably also the surrounding carcass layer matters a lot.
Fundamentally all it'd do is change the effective mu and maybe the force normal, but figuring out the relationship seems difficult. It's probably easiest to actually just program a physical model for the heating behavior and use it to correlate measured ball trajectories, bat head forces and thermal imaging measurements of the contact patch temperature.
Some day I may try to just do this for fun, but I wouldn't expect it in the next decade to be honest.